June 07, 2012 Lehigh Valley, Pa.
Air Products (NYSE: APD) today announced that its new-generation Inert Wave Soldering technology has recently won the 6th SMT China Vision Award in the wave soldering category. This technology addresses the major quality and cost issues faced by the electronics assembly and packaging industry by providing improved nitrogen inerting in wave soldering applications.
The SMT China Vision award recognizes industry experts in China’s electronics manufacturing market. Winning products and technologies were selected by a distinguished panel of independent judges based on their contributions in helping the downstream industry to reduce cost, improve quality, increase efficiency, enhance reliability, ensure safety, and protect the environment.
Air Products’ new-generation Inert Wave Soldering technology is recognized for its effectiveness in reducing soldering defect rates and achieving overall better and lower-cost production. It is the next generation of its original patented designs that are currently in operation around the globe. Through its efficient use of nitrogen, this new-generation technology enables customers to reduce manufacturing and material costs, including reduced nitrogen flow rates; significantly increase soldering joint quality; and transition to lead-free soldering technology with minimal effort. In addition, the technology can significantly reduce key defects and dross formation by up to 90% in day-on-day production.
“We are convinced that Air Products’ Inert Wave Soldering technology will bring quality improvement and cost savings by reducing defects and flux usage, as well as help protect the environment by minimizing solder dross, hence bringing competitive edge to its customers,” says Simon Lian Sui Ren, editor-in-chief of SMT China magazine, in summarizing the comments from SMT China Vision Awards judges.
“We are excited to receive this SMT China Vision Award and honored to be the first and only winner in the industrial gases industry since its launch in 2007,” said Greg Arslanian, global manager for Electronics Packaging, Assembly and Test at Air Products. “This award is a confirmation of the superior performance of our Inert Wave Soldering technology from the downstream SMT industry. Through the dedication and commitment of our China based R&D and commercial technology teams in our Electronics Packaging, Assembly and Test Center of Excellence in Shanghai, we have developed and improved this system to address the local and global market needs in electronics assembly. Air Products will continue to develop technologically leading solutions for our customers.”
Air Products is a total solutions supplier to the global electronics assembly, packaging and testing industry. For more than 20 years, the company has been providing customers around the world with technology, gases and know-how for wave, reflow, and selective soldering. For more information, visit www.airproducts.com/electronics_assembly.
Air Products (NYSE:APD) provides atmospheric, process and specialty gases; performance materials; equipment; and technology. For over 70 years, the company has enabled customers to become more productive, energy efficient and sustainable. More than 18,000 employees in over 40 countries supply innovative solutions to the energy, environment and emerging markets. These include semiconductor materials, refinery hydrogen, coal gasification, natural gas liquefaction, and advanced coatings and adhesives. In fiscal 2011, Air Products had sales of approximately $10billion. For more information, visit www.airproducts.com.
NOTE: This release may contain forward-looking statements within the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on management’s reasonable expectations and assumptions as of the date of this release regarding important risk factors. Actual performance and financial results may differ materially from projections and estimates expressed in the forward-looking statements because of many factors not anticipated by management, including risk factors described in the Company’s Form 10K for its fiscal year ended September 30, 2011.