Corrosive gases are used in the semiconductor fabrication process to clean process equipment and semiconductor wafers, to etch substrates, and for chemical vapor deposition (CVD). A major concern of the industry is to properly handle the exhaust gases from these operations in a way that protects the environment and workers’ health. Chemicals present in the exhaust gases are toxic and hazardous and must be treated before they can be vented into the atmosphere. This technology is a method of removing fluorine present in exhaust gas from semiconductor manufacturing operations. The fluorine removal process also focuses on using a fixed bed of activated alumina to remove fluorine and trace fluorine compounds present in exhaust gas.
- Eliminates un-reacted fluorine from exhaust gases
- Reduces safety concerns by eliminating OF2 and NoF3.
- Avoids the disadvantages of wet scrubbing.
Priority Patent Docket No.
|Removing Fluorine from Semiconductor Processing Exhaust Gas
Air Products is offering this technology for license or sale.
Fluorine Removal Process
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