When the road ahead is challenging, Air Products’ ComPAT-LoK program makes for a smoother ride.

Integrating high-performance low-k materials is one of your greatest challenges. That’s where Air Products’ ComPAT-LoK compatibility assurance program can make all the difference. We’ve developed and proven our recommended offering to be compatible with porous low-k films from first generation 2.5 films down to 2.0 low k films for next generation technology nodes.

Air Products’ ComPAT-LoK compatibility assurance program focuses on the integrated product chemistries, to reduce demand on the customer, and deliver proven technologies. It enables you to get a head start on your advanced technology integration, proving the extendibility of porous low-k beyond 45 and 32 nm. Many aspects of porous low-k processing are covered by Air Products’ ComPAT-LoK program including dielectric deposition, etch, wet cleans, CMP and post CMP cleans.

Overcome the Challenges
To enhance the development process, the ComPAT-LoK program focuses on the advanced technology node challenges from new materials integration to provide minimal damage to PDEMS, high performance for the specific integrated product requirements and single level metal feasibility. Technical experts collectively work together to address compatibility issues prior to bringing the chemistry to high volume manufacturing, thereby lowering your development time and costs, and helping to achieve the highest probability of success.

To find out more about our ComPAT - LoK compatibility assurance program contact John Caligiuri, from our Advanced Integration Materials group.

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