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Chamber Cleaning Technical Papers |
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PE-CVD AMAT DxL
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Reducing the Cost of Ownership of CVD Chamber Cleaning While Minimizing Environmental Emissions
This is a joint Powerpoint presentation from Air Products and Infineon Technologies used at SEMICON West 2005.
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Applied Materials DxL NF3 Remote Retrofits
Motorola, Air Products, and Applied Science and Technology work in combination with International SEMATECH
NF3 Remote Retrofits are a viable alternative for companies interested in reducing PFC emissions from their installed C2F6 tool base. PFC emissions were effectively eliminated as NF3 utilization rates exceeded 99%. NF3 cleans were also found to be 30-50% faster than the baseline C2F6 clean.
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Applied Materials DxL C2F6 Optimization
Air Products and Daido Air Products work presented at SEMICON West 2000
Substantial reductions in gas costs and PFC emissions can be achieved by optimizing traditional C2F6-based in situ cleans.
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Applied Materials DxL C2F6 Chamber Clean for a SiNx Process (SiH4 Chamber)
Air Products and Infineon Work Presented at the ISESH 10th Annual Conference Noordwijk 2003 and Published in FUTURE FAB International Issue 15 - WAFER PROCESSING
Gas usage and PFC emissions were reduced 68% and 61% respectively, for the optimized C2F6 process relative to the baseline CF4 process. C4F8 was found to be not a feasible drop-in replacement due to weak end-point signal, stability problems, and additional investment for gas supply systems.
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Applied Materials DxL Dilute NF3 In-situ Chamber Clean Optimization
Air Products Research Presented at Semicon West 2003
Dilute NF3 recipes provide a viable alternative to perfluorocarbon based in situ cleans. Substantial reductions in clean time, global warming emissions and gas usage are possible.
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Evaluating the Performance of In-situ Chamber Cleaning Gases on an Applied Materials P-5000 DxL (Lamp Heated) Reactor
Air Products Research Presented at Semicon Southwest 2001
Standard C2F6 recipes are optimized in the lab and in the field demonstrating significant reductions in emissions and gas usage. Alternative fluorocarbon gases offered no significant benefits over optimized C2F6. Optimized Dilute NF3 process offers further step change improvement.
Semi.SW.DxL5 (PDF, 1,622 K)
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Improving the Environmenatl Performance of In Situ PECVD Chamber Cleaning Processes by studies of CVD Reactor Clean Performance and Field Evaluation of Optimised Processes
Electronics Goes Green 2004, 9/6-8/2004, Berlin, Germany
Alternative fluorocarbon gases (C2F6, NF3, C3F8, C4F8 and C4F8O) are evaluated for cleaning Applied Materials DxL CVD chambers. The standard C2F6 recipe can be successfully optimised, resulting in significant reductions in emissions (51%) and gas usage (40%). Similar reductions are achieved using C3F8, C4F8 and C4F8O but there are no performance advantages over C2F6, when optimised processes are compared. Significant improvements are observed over the standard C2F6 recipe for a dilute NF3 process (94% and 77% reduction in emissions and gas usage respectively, 11% reduction in clean time).
EGG2004 paper (PDF, 303 K)
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