Reducing the Cost of Ownership of CVD Chamber Cleaning While Minimizing Environmental Emissions This is a joint Powerpoint presentation from Air Products and Infineon Technologies used at SEMICON West 2005.    SEMIWest2005_ChamberCleaning (PDF, 396 K)

Applied Materials DxZ NF3 Remote Retrofit (µClean) and PFC Reduction Motorola, Air Products, and Applied Materials work in combination with International SEMATECH   Demonstrated that high utilization efficiencies of NF3 (>90%) along with reduced clean times are possible for the µClean Technology in an actual manufacturing environment. Moto DxZ SEMATECH TTD (PDF, 472 K)

Applied Materials DxZ C2F6 Optimization Air Products and TSMC collaborative work   Process cleans were identified that reduce PFC emissions by 75% and clean times by 9-18% vs. the baseline C2F6 process. ECS 2000 (PDF, 372 K)

Applied Materials DxZ C2F6 Optimization Air Products and Daido Air Products work presented at SEMICON West 2000   Substantial reductions in gas costs and in PFC emissions can be achieved by optimizing traditional C2F6-based in situ cleans. PFC Minimization SEMIW00 (PDF, 284 K) PFC Review SEMIW00 (PDF, 528 K)

In-situ Chamber Cleaning of Low k Films on an Applied Materials P-5000 DxZ Chamber Air Products Research Presented at Semicon Southwest 2001   Cleaning time and MMTCE for OSG Low k films are shown to be comparable to PE-TEOS based SiO2. Standard C2F6-based processes can be optimized. Optimized Dilute NF3 process offers further step change improvement. SemiSW Oct'01 DxZ(Lowk) Abstract (PDF, 73 K) SemiSW.Oct01.Presentation.DXZ (PDF, 930 K)