I'm experiencing pattern collapse in my lithography process. What can help me overcome this problem?
Pattern collapse can be a major obstacle in 193 nm and 248 nm photolithography processes. Air Products' OptiPatternTM Surface Conditioning Solution will reduce pattern collapse in this key integrated circuit manufacturing step without attacking your resist. By significantly reducing the capillary force exerted on resist features, OptiPattern solution ultimately reduces pattern collapse. There is no degradation of resist profile or change of CD/CD uniformity when OptiPattern solution is applied, so there is no need for any changes in the established development conditions to use OptiPattern solution. Additionally, its chemistry is compatible with a wide variety of resists. Processors can insert a new step in their develop process between the DI water rinse and drying steps to dispense and puddle the OptiPattern Solution on wafer surfaces. The OptiPattern solution can be dispensed through a second develop nozzle. We have achieved geometries as small as 25 nm semi-dense lines with an aspect ratio of 6.8, and 80 nm dense lines with an aspect ratio of 3.8.
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