Technical Reference

	Material Compatibility Chart and Physical Properties
	Compressed Gas Association Cylinder Valve Fitting Specifications
GASGUARD®
	GASGUARD AP Controllers
	GASGUARD Bulk Specialty Gas Systems (BSGS): the Standard for the Electronics Industry
	GASGUARD Bulk Specialty Gas Supply (BSGS) Systems: Making the Best Better
	GASGUARD Bulk Specialty Gas System- Nitrogen Trifluoride (NF3) Preferred Offering
	GASGUARD Gas Delivery Systems
	GASGUARD Networking Tools
	GASGUARD Systems: Safe, Reliable, Cost-Effective, Consistent Performers for the Electronics Industry
Microelectronics
	Atmosphere Effects on Soldering of Flip Chip Assemblies
	Evaluating the impact of an acetylenic diol - type surfactant on DUV lithography performance
	Controlled Atmospheres for Soldering Processes
	Feasibility of Fluxless Reflow of Lead-free Solders in Hydrogen and Forming Gas
	Fluxless Soldering of Flip Chip Assemblies
	Effects of Reduced Purity Nitrogen in the Inert Wave Soldering Environment
	Testing and Analysis of Surface Mounted Lead Free Soldering Materials and Processes
	Oxygen Concentration in the Soldering Atmosphere – How Low Must We Go?
	Wave Soldering Performance and Optimization of VOC-Free, No Clean Fluxes
	Effects of Atmosphere Composition on Soldering Performance of Lead Free Alternatives
	Effect of Nitrogen Atmosphere on the Self-Alignment Properties of a Pb-free Solder
	NitroFAS- Nitrogen for Advanced Soldering
	Wave Solder
	Inert Gas Soldering Benefits
	Microelectronics-Your Global Gas and Technology Partner
	Microelectronics Technical CD Request
	Cost of Ownership Data
	Cost of Ownership Questionnaire
Request the following papers:
To request a paper which is not currently available electronically, please fill out our online form and check the box of the paper(s) you are requesting. A copy of the paper(s) will be mailed to you as soon as possible. The following papers are available:
	"Hydrogen Fluxless Soldering of Flip-Chip Solder Joints" C. Christine Dong, Air Products and Chemicals, Inc.
	“Fluxless Soldering in Wave Soldering Equipment Using Forming Gas” G. Arslanian, Air Products, D. Jean, U.S. Robotics, D. Lu, Teknor Microsystems
	“Controlled Atmosphere Soldering” C. Christine Dong, Air Products
	“Optimizing the Inert Wave Soldering Process with Hot Nitrogen Knives” Chrys Shea, Siemens Business Communication Systems and Gary Shipe, Air Products
	“Case History of Utilizing Nitrogen in IR Reflow Soldering” Kermit Aguayo of Xetel Corporation and Kelly Boyer of Air Products
	“Retrofitting Infrared Reflow Furnaces” Stephen W. Jacobs of Air Products