EA Technology for Hydrogen Activation offers the following benefits for wafer bump reflow:

  • Enhances bump reflow quality (no flux-induced solder voids and wafer contaminations)
  • Improves productivity (in-line process, no need for post wafer cleaning and furnace down time cleaning)
  • Reduces cost of ownership (no need for cleaning equipment, solution, labor work, and flux)
  • Improves safety (no flux exposure, using a non-toxic and non-flammable gas mixture) 
  • Reduces environmental issues (no organic vapors, hazard residues, and CO2 emission)


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