Features/Benefits

EA Technology for Hydrogen Activation offers the following benefits for wafer bump reflow:

  • Enhances bump reflow quality (no flux-induced solder voids and wafer contaminations)
  • Improves productivity (in-line process, no need for post wafer cleaning and furnace down time cleaning)
  • Reduces cost of ownership (no need for cleaning equipment, solution, labor work, and flux)
  • Improves safety (no flux exposure, using a non-toxic and non-flammable gas mixture) 
  • Reduces environmental issues (no organic vapors, hazard residues, and CO2 emission)


X

This site uses cookies to store information on your computer. Some are essential to make our site work; others help us to better understand our users. By using the site, you consent to the placement of these cookies. Read our Legal Notice to learn more.

Close