The electronics assembly and packaging industry (Printed circuit board assembly) is constantly adjusting to satisfy the requirements of the newest generation of semiconductors. Smaller footprint device sizes, 2.5D and 3D TSV packaging are just some of the changes that have occurred. With these changes come challenges we can help you solve.
The new advanced designs and emerging technologies make it more critical to get the solder joints perfect the first time. Optimizing reflow soldering, wave soldering and selective soldering processes is where we can help you achieve:
- More process up time / Increased productivity
- Improved cost of ownership
- Overall defect reduction – shorts, icicles,
- Less waste /material usage
Let Air Products put our experience in advance packaging to work for you. We provide total solutions for your electronics packaging and assembly requirements with equipment, technology and reliable gas supply. We have the expertise that comes from being a leading supplier to the industry around the world. Call us at 800-654-4567.
Benefits of inert gas soldering for printed circuit board assembly processes
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Facilitating the reduction of head-in-pillow defects and improving assembly reliability and in-line productivity using nitrogen reflow
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Cost effective and user friendly nitrogen inerting technology for lead-free wave soldering
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Expertise, technology, and gases: A total solution for the global electronics packaging, assembly and test industry
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