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Technical Papers

To request a paper which is not currently available electronically, please fill out the information below and check the box of the paper(s) you are requesting. A copy of the paper(s) will be mailed to you as soon as possible.

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IC Packaging
Printed Circuit Board Assembly
Printed Circuit Manufacturing
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"Fluxless Soldering in Wave Soldering Equipment Using Forming Gas" G. Arslanian, Air Products, D. Jean, U.S. Robotics, D. Lu, Teknor Microsystems

 

"Controlled Atmosphere Soldering" C. Christine Dong, Air Products

 

"Optimizing the Inert Wave Soldering Process with Hot Nitrogen Knives" Chrys Shea, Siemens Business Communication Systems and Gary Shipe, Air Products

 

"Case History of Utilizing Nitrogen in IR Reflow Soldering" Kermit Aguayo of Xetel Corporation and Kelly Boyer of Air Products

 

"Retrofitting Infrared Reflow Furnaces" Stephen W. Jacobs of Air Products