Air Products Home

Electronics Test, Assembly & Packaging

The electronics assembly and packaging industry is constantly adjusting to satisfy the requirements of the newest generation of microelectronics. Smaller device sizes, the use of lead-free solders, and “no clean” flux chemistries are just some of the changes that have occurred with reflow soldering, wave soldering and selective soldering processes. Whatever the technology, the critical factor in integrated circuit (IC) packaging and printed circuit (PC) board assembly are process improvements that contribute to defect reduction, improved process uptime and an overall improvement in the cost of ownership. With more than 20 years of industry experience, Air Products can help you achieve more profits with fewer defects. We provide the total solution for electronics assembly and packaging, offering novel technologies, reliable gas supply atmospheres and the expertise that comes from being a leading supplier to the industry around the world.

View our brochure:

Expertise, technology, and gases: A total solution for the global electronics packaging, assembly and test industry
Download PDF (2.4 MB)

News Releases

Air Products to Highlight Advances in Electron Attachment for Soldering Applications at IPC APEX Expo

Air Products Unveils Advanced Gas Applications Lab at Shanghai Technology Center

2012 SMT China Vision Award for New-Generation Inert Wave Soldering Technology

Nitrogen Reflow- A solution for reducing head-in-pillow (HIP) defects and improving assembly reliability Nitrogen reflow

Nitrogen reflow (6:14)

A solution for reducing head-in-pillow (HIP) defects and improving assembly reliability

New electron attachment (EA) technology advantages

New electron attachment (EA) technology advantages

are improved solder wetting and no flux residue

A total solution for the global electronics packaging, assembly and test industry

Expertise, technology, and gases

A total solution for the global electronics packaging, assembly and test industry

of
X

This site uses cookies to store information on your computer. Some are essential to make our site work; others help us to better understand our users. By using the site, you consent to the placement of these cookies. Read our Legal Notice to learn more.

Close