The electronics assembly and packaging industry is constantly adjusting to satisfy the requirements of the newest generation of microelectronics. Smaller device sizes, the use of lead-free solders, and “no clean” flux chemistries are just some of the changes that have occurred with reflow soldering, wave soldering and selective soldering processes. Whatever the technology, the critical factor in integrated circuit (IC) packaging and printed circuit (PC) board assembly are process improvements that contribute to defect reduction, improved process uptime and an overall improvement in the cost of ownership. With more than 20 years of industry experience, Air Products can help you achieve more profits with fewer defects. We provide the total solution for electronics assembly and packaging, offering novel technologies, reliable gas supply atmospheres and the expertise that comes from being a leading supplier to the industry around the world.
View our brochure:
A Total Solution for the Global Electronics Packaging, Assembly and Test Industry
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