Electron attachment (EA) is a new concept for ambient-pressure gas activation that brings several advantages compared with plasma-based gas activation. Our study shows that the starting temperature for EA to activate hydrogen is as low as 100 °C. Air Products’ proprietary EA technology can be built into your standard assembly and packaging processes and has the potential to be applied to a list of applications ranging from wafer, die, and chip levels to the traditional assembly of printed circuit boards. A breakthrough technology, EA-activated forming gas can effectively clean soldering surfaces during fluxless die attach, resulting in improved solder wetting, lower reflow temperature, decreased overall voiding tendency, and no flux residue-related problems. Research conducted by Air Products has demonstrated that it’s possible to achieve a high-quality die attach with zero to near-zero voids by using EA. The results can improve your product quality and increase your productivity, both contributing to a lower cost of ownership for your soldering process.

Fluxless Die Attach by Activated Forming Gas Presented by Dr. Christine Dong and Russell A. Siminski (Presentation first published at the IPC APEX 2013 technical conference.) Study results shown in this presentation demonstrate that it is possible to achieve a high-quality die attach with zero or near-zero voids by using EA. Download Presentation Slides (1.0 MB)

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