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See how electron attachment completely eliminates flux residues.
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See the benefits that electron attachment can bring to your reflow soldering for electronic assemblies.
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Electron attachment (EA) is a new concept for ambient-pressure gas activation that brings several advantages compared with plasma-based gas activation. Our study shows that the starting temperature for EA to activate hydrogen is as low as 100 °C. Air Products’ proprietary EA technology can be built into your standard assembly and packaging processes and has the potential to be applied to a list of applications ranging from wafer, die, and chip levels to the traditional assembly of printed circuit boards. A breakthrough technology, EA-activated forming gas can effectively clean soldering surfaces during fluxless die attach, resulting in improved solder wetting, lower reflow temperature, decreased overall voiding tendency, and no flux residue-related problems. Research conducted by Air Products has demonstrated that it’s possible to achieve a high-quality die attach with zero to near-zero voids by using EA. The results can improve your product quality and increase your productivity, both contributing to a lower cost of ownership for your soldering process.
Interview with Christine Dong
Watch real time with IPC interview with Dr. Christine Dong from the IPC Apex 2013 Show. Dr. Christine provides a summary of Air Products' electron attachment (EA) technology and how it can be used in your process.
LiteratureFluxless Soldering Using Electronic Attachment Technology
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News ReleaseAir Products to Highlight Advances in Electron Attachment for Soldering Applications at IPC APEX Expo