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Epoxy Adhesives—1K

Air Products provides an extensive line of one-component (1K) epoxy curing agents, allowing epoxy formulators to meet a vast array of adhesive challenges with innovative chemistries.

Within the world of adhesives, the term “one-component” indicates that the curing agent and resin are packaged together as a single unit by the formulator, and will remain stable (i.e. will not react) until the appropriate environmental conditions are applied. Major market applications for one-component adhesives include automotive, aerospace, microelectronics and electrical insulation compounds.

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Product NameDescription/BenefitsDownloads

Amicure CG1200G

Dicyandiamide pulverized to 90% less than 30 micron particle size. Contains 1.5% of an inert flow control additive. Used in powder coatings; structural laminates, including solvent-free prepregs; one-component adhesives; and film adhesives.

Dicyandiamide pulverized to 90% less than 30 micron particle size. Contains 1.5% of an inert flow control additive. Used in powder coatings; structural laminates, including solvent-free prepregs; one-component adhesives; and film adhesives.

Amicure CG325G

Dicyandiamide pulverized to 90% less than 44 micron particle size. Contains 1.5% of an inert flow control additive. Used in structural laminates and one-component adhesives.

Dicyandiamide pulverized to 90% less than 44 micron particle size. Contains 1.5% of an inert flow control additive. Used in structural laminates and one-component adhesives.

Amicure CGNA

Unpulverized dicyandiamide with no inert flow control agent. Used in electrical laminates, adhesives, and powder coatings, where the total resin system is pulverized prior to extrusion.

Unpulverized dicyandiamide with no inert flow control agent. Used in electrical laminates, adhesives, and powder coatings, where the total resin system is pulverized prior to extrusion.

Amicure DBUE

Unpulverized dicyandiamide with no inert flow control agent. Used in electrical laminates, adhesives, and powder coatings, where the total resin system is pulverized prior to extrusion.

Unpulverized dicyandiamide with no inert flow control agent. Used in electrical laminates, adhesives, and powder coatings, where the total resin system is pulverized prior to extrusion.

Amicure UR 7/10

Substituted urea-based accelerator for dicyandiamide-cured epoxy resins. Finely ground version of AMICURE® UR7/10. Used in one-component adhesives, heat-cured composites, and prepregs.

Substituted urea-based accelerator for dicyandiamide-cured epoxy resins. Finely ground version of AMICURE® UR7/10. Used in one-component adhesives, heat-cured composites, and prepregs.

Amicure UR2T

Substitute for chlorophenyl ureas; co-curing accelerator for dicyandiamide-cured epoxy resins. Faster green strength adhesion build. Used in one-component paste and film adhesives, high-performance composites, and prepregs.

Substitute for chlorophenyl ureas; co-curing accelerator for dicyandiamide-cured epoxy resins. Faster green strength adhesion build. Used in one-component paste and film adhesives, high-performance composites, and prepregs.

Ancamine 2014FG

Finer version of Ancamine® 2014AS. Provides faster development of properties. Used in one-component adhesives, including induction-cured adhesives; potting and casting; prepregs; film adhesives; and as an accelerator for dicyandiamide.

Finer version of Ancamine® 2014AS. Provides faster development of properties. Used in one-component adhesives, including induction-cured adhesives; potting and casting; prepregs; film adhesives; and as an accelerator for dicyandiamide.

Ancamine 2337S

Modified aliphatic amine with rapid reactivity above 158 °F and rapid development of green strength. In form of a micronized powder. Used in one-component adhesives, potting, coatings, hot-melt prepregs, and as an accelerator for DICY.

Modified aliphatic amine with rapid reactivity above 158 °F and rapid development of green strength. In form of a micronized powder. Used in one-component adhesives, potting, coatings, hot-melt prepregs, and as an accelerator for DICY.

Ancamine 2441

Modified aliphatic amine. Provides low activation temperature and fast green strength development. Used in one-component heat-cured adhesives, powder coatings, potting compounds, hot melt prepregs, and as an accelerator for anhydrides to provide good high-temperature stability.

Modified aliphatic amine. Provides low activation temperature and fast green strength development. Used in one-component heat-cured adhesives, powder coatings, potting compounds, hot melt prepregs, and as an accelerator for anhydrides to provide good high-temperature stability.

Ancamine 2442

Modified aliphatic amine. Provides excellent balance of low activation temperature, good shelf stability, and high glass transition temperature. Used in one-component adhesives, powder coatings, potting compounds, coatings, hot melt prepregs, and as an accelerator for anhydrides.

Modified aliphatic amine. Provides excellent balance of low activation temperature, good shelf stability, and high glass transition temperature. Used in one-component adhesives, powder coatings, potting compounds, coatings, hot melt prepregs, and as an accelerator for anhydrides.

DICYANEX 1400B

Micronized grade of dicyandiamide containing 3% of an inert flow control additives to inhibit clumping and improve handling. Finest particle size available in DICYANEX® line for maximum reactivity. Used in one-component adhesives, recreational and industrial prepreg composites, and powder coat.

Micronized grade of dicyandiamide containing 3% of an inert flow control additives to inhibit clumping and improve handling. Finest particle size available in DICYANEX® line for maximum reactivity. Used in one-component adhesives, recreational and industrial prepreg composites, and powder coat.

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