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Metallization

Air Products supplies specialty gases and chemicals for use in semiconductor metallization applications. Our offerings include CupraSelect® and Tungsten Hexafluoride (WF6). For more information on each of our metallization offerings for your application, please click on the link below.

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CupraSelect (CuTMVS)

CupraSelect® (CuTMVS) is a precursor for depositing high quality copper films by CVD. Capable of depositing conformal films within features such a vias.

CupraSelect® (CuTMVS) is a precursor for depositing high quality copper films by CVD. Capable of depositing conformal films within features such a vias.

Pentakis-dimethylamino Tantalum (PDMAT)

Pentakis-dimethylamino Tantalum (PDMAT) is a solid source material for chemical vapor deposition or atomic layer deposition of highly conformal tantalum oxide or tantalum nitride films.

Pentakis-dimethylamino Tantalum (PDMAT) is a solid source material for chemical vapor deposition or atomic layer deposition of highly conformal tantalum oxide or tantalum nitride films.

Tetrakis-dimethylamino Titanium (TDMAT)

Tetrakis-dimethylamino Titanium (TDMAT), a Schumacher® product, is a liquid chemical source suitable for the chemical vapor Thin Film Deposition (CVD) of titanium nitride films.

Tetrakis-dimethylamino Titanium (TDMAT), a Schumacher® product, is a liquid chemical source suitable for the chemical vapor Thin Film Deposition (CVD) of titanium nitride films.

TiCl4 (Titanium Tetrachloride)

Titanium Tetrachloride (TiCl4), a Schumacher® product, is a liquid source material for the chemical vapor Thin Film Deposition (CVD) of titanium nitride, titanium dioxide and titanium metal.

Titanium Tetrachloride (TiCl4), a Schumacher® product, is a liquid source material for the chemical vapor Thin Film Deposition (CVD) of titanium nitride, titanium dioxide and titanium metal.

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