Air Products Home

Photoresist Stripping

Air Products supplies specialty chemicals for use in semiconductor photoresist stripping applications. Our offering features our ACT® specialty chemical strippers.

Contact Us

Online Contact Form

Contact Information

Product NameDescription/BenefitsDownloads

ACT® 114 Etch Residue Remover

ACT® 114 is a low hydroxylamine (HA) formulation designed for aluminum BEOL cleaning. ACT 114 has the advantage of zero etch of silicon and provides a lower cost-of-ownership and superior EH&S profile.

ACT® 114 is a low hydroxylamine (HA) formulation designed for aluminum BEOL cleaning. ACT 114 has the advantage of zero etch of silicon and provides a lower cost-of-ownership and superior EH&S profile.

ACT® 273 Etch Residue Remover

ACT® 273 is a semiaqueous product designed for CoWP/Cu and porous low-k technologies.

ACT® 273 is a semiaqueous product designed for CoWP/Cu and porous low-k technologies.

ACT® 3NR

Formulated for negative spin on and dry film thick photo resist removal processes. Environmentally-friendly chemistry with extended bath life to help customers achieve their cost-of-ownership (COO) benefits.

Formulated for negative spin on and dry film thick photo resist removal processes. Environmentally-friendly chemistry with extended bath life to help customers achieve their cost-of-ownership (COO) benefits.

ACT® 410

ACT 410 is a specially formulated product for stripping hard to remove positive photoresist, including UV-cured resist and organic etch residue

ACT 410 is a specially formulated product for stripping hard to remove positive photoresist, including UV-cured resist and organic etch residue

ACT® 412

ACT 412 is a specially formulated product for stripping hard to remove positive photoresist, including UV-cured resist and organic etch residue.

ACT 412 is a specially formulated product for stripping hard to remove positive photoresist, including UV-cured resist and organic etch residue.

ACT® 690SX

ACT 690SX is an organic solvent-based blend that is very effective in removing severely processed photoresist films and etch residue over corrosive sensitive metals and alloys.

ACT 690SX is an organic solvent-based blend that is very effective in removing severely processed photoresist films and etch residue over corrosive sensitive metals and alloys.

ACT® 814

ACT® 814 is a dilute acid chemistry specially formulated for removing refractory etch residues on Al/Cu and Cu/low k technologies.

ACT® 814 is a dilute acid chemistry specially formulated for removing refractory etch residues on Al/Cu and Cu/low k technologies.

ACT® 915A Etch Residue Remover

ACT® 915A is a highly effective hydroxylamine (HA) based product for aluminum clean applications. It is well adopted in the worldwide semiconductor industry.

ACT® 915A is a highly effective hydroxylamine (HA) based product for aluminum clean applications. It is well adopted in the worldwide semiconductor industry.

ACT® 927C Etch Residue Remover

ACT® 927C is a highly effective (HA) product for aluminum clean applciations.  It is extremely successful in removing refractory etch residue while protecting exposed aluminum, titanium and tungsten.

ACT® 927C is a highly effective (HA) product for aluminum clean applciations.  It is extremely successful in removing refractory etch residue while protecting exposed aluminum, titanium and tungsten.

ACT® 930 Etch Residue Remover and Positive Photoresist Stripper

ACT® 930 is low hydroxylamine (HA) based product for aluminum applications. It is low cost and extremely effective in removing etch residue.  It is well adopted in the worldwide semiconductor industry.

ACT® 930 is low hydroxylamine (HA) based product for aluminum applications. It is low cost and extremely effective in removing etch residue.  It is well adopted in the worldwide semiconductor industry.

ACT® 935 UP Etch Residue Remover and Positive Photoresist Stripper

ACT® 935 UP is a highly effective hydroxylamine (HA) based product for aluminum applications. It is well adopted in the worldwide semiconductor industry.

ACT® 935 UP is a highly effective hydroxylamine (HA) based product for aluminum applications. It is well adopted in the worldwide semiconductor industry.

ACT® 937 UP

ACT® 937 UP, a member of the Hydroxylamine family of resist stripper products, is extremely effective in removing photoresist and refractory etch.

ACT® 937 UP, a member of the Hydroxylamine family of resist stripper products, is extremely effective in removing photoresist and refractory etch.

ACT® 940

ACT 940 is a highly effective HA-containing etch residue remover and positive photoresist stripper.

ACT 940 is a highly effective HA-containing etch residue remover and positive photoresist stripper.

ACT® 970 Etch Residue Remover and Positive Photoresist Stripper

ACT® 970 is an extremely effective amine-based product for aluminum and copper applications.

ACT® 970 is an extremely effective amine-based product for aluminum and copper applications.

ACT® AS-65

ACT® AS-75 is a highly effective non-Hydroxylamine (HA) amine-based stripper with cleaning performance rivaling that of HA-containing products. Applications include removing refractory etch residues and photoresist on Al/Cu, Cu and low-k technologies.

ACT® AS-75 is a highly effective non-Hydroxylamine (HA) amine-based stripper with cleaning performance rivaling that of HA-containing products. Applications include removing refractory etch residues and photoresist on Al/Cu, Cu and low-k technologies.

ACT® AS-65 Etch Residue Remover and Positive Photoresist Stripper

ACT® AS-65 is a highly effective non-hydroxylamine (HA) stripper used for photoresist stripping and residue removal in aluminum applications.

ACT® AS-65 is a highly effective non-hydroxylamine (HA) stripper used for photoresist stripping and residue removal in aluminum applications.

ACT® AS-70

ACT® AS-70 is a highly effective non-hydroxylamine (HA) amine-based stripper with cleaning performance rivaling that of HA-containing products. Applications include removing refractory etch residues and photoresist on Al/Cu, Cu and low-k technologies.

ACT® AS-70 is a highly effective non-hydroxylamine (HA) amine-based stripper with cleaning performance rivaling that of HA-containing products. Applications include removing refractory etch residues and photoresist on Al/Cu, Cu and low-k technologies.

ACT® AS-80

ACT® AS-80 has excellent cleaning capabilities that make this product unique. It is a highly effective non-Hydroxylamine (HA) stripper with similar cleaning performance to HA-containing strippers. ACT AS-80 can be used in aluminum applications.

ACT® AS-80 has excellent cleaning capabilities that make this product unique. It is a highly effective non-Hydroxylamine (HA) stripper with similar cleaning performance to HA-containing strippers. ACT AS-80 can be used in aluminum applications.

ACT® AS-85 Etch Residue Remover and Positive Photoresist Stripper

ACT® AS-85 has excellent cleaning capabilities that make this product unique. It is a highly effective non-hydroxylamine (HA) stripper with cleaning performance similar to non HA-containing stripper. It is used for photoresist stripping and residue removal in aluminum applications.

ACT® AS-85 has excellent cleaning capabilities that make this product unique. It is a highly effective non-hydroxylamine (HA) stripper with cleaning performance similar to non HA-containing stripper. It is used for photoresist stripping and residue removal in aluminum applications.

ACT® CMIK-S

ACT®CMIK-S is a proprietary formulation specifically designed for the effective removal of positive photoresists from highly corrosion-sensitive metals and metal alloy substrates.

ACT®CMIK-S is a proprietary formulation specifically designed for the effective removal of positive photoresists from highly corrosion-sensitive metals and metal alloy substrates.

ACT® CMI-S

ACT CMI-S is a corrosion inhibited water-soluble solution which effectively removes hard-processed positive resist and organic etch residue from corrosion-sensitive metal alloy substrates.

ACT CMI-S is a corrosion inhibited water-soluble solution which effectively removes hard-processed positive resist and organic etch residue from corrosion-sensitive metal alloy substrates.

ACT® EZSTRIP® 20 Etch Residue Remover and Positive Photoresist Stripper

ACT® EZSTRIP® 20 is a highly-effective non-hydroxylamine (HA) amine residue remover with the cleaning performance of HA-containing products. This product can be used in aluminum applications.

ACT® EZSTRIP® 20 is a highly-effective non-hydroxylamine (HA) amine residue remover with the cleaning performance of HA-containing products. This product can be used in aluminum applications.

ACT® EZSTRIP® 528H

ACT EZSTRIP 528H is a fluoride-containing chemistry specially formulated for effective removal of post-etch and ash residue.  Designed to be an aggressive cleaners mild process conditions.

ACT EZSTRIP 528H is a fluoride-containing chemistry specially formulated for effective removal of post-etch and ash residue.  Designed to be an aggressive cleaners mild process conditions.

ACT® NE-111

ACT® NE-111 is a buffered, pH stable fluoride-containing stripper specifically formulated for removal of highly oxidized etch residues while reducing surface metal contamination.

ACT® NE-111 is a buffered, pH stable fluoride-containing stripper specifically formulated for removal of highly oxidized etch residues while reducing surface metal contamination.

ACT® NE-14

ACT NE-14 is a fluoride-containing chemistry specially formulated for removal of organic and highly oxidized etch residues and/or for controlled etching of contaminated oxide surfaces, including through-silicon vias and sidewalls.

ACT NE-14 is a fluoride-containing chemistry specially formulated for removal of organic and highly oxidized etch residues and/or for controlled etching of contaminated oxide surfaces, including through-silicon vias and sidewalls.

ACT® NE-168

ACT NE-168 is a buffered fluoride-containing stripper product engineered to meet the challenging requirements of semiconductor surface preparation technology.  The formulation removes ash and etch residue and is compatible with copper and low-k materials.

ACT NE-168 is a buffered fluoride-containing stripper product engineered to meet the challenging requirements of semiconductor surface preparation technology.  The formulation removes ash and etch residue and is compatible with copper and low-k materials.

ACT® NE-89

ACT NE-89 is a fluoride-containing chemistry specifically formulated for use in etch residue removal and/or controlled etching of contaminated oxide surfaces, including through-silicon vias and sidewalls.

ACT NE-89 is a fluoride-containing chemistry specifically formulated for use in etch residue removal and/or controlled etching of contaminated oxide surfaces, including through-silicon vias and sidewalls.

ACT® 970T

ACT 970T is effective in removing refractory etch residue while protecting exposed copper. It was designed specifically for use on substrates where copper corrosion is of concern.

ACT 970T is effective in removing refractory etch residue while protecting exposed copper. It was designed specifically for use on substrates where copper corrosion is of concern.

ACT® NE-200

ACT® NE-200 is a fluoride-containing product especially formulated for removal of inorganic and highly oxidized etch residues and/or for controlled etching of contaminated oxide surfaces.

ACT® NE-200 is a fluoride-containing product especially formulated for removal of inorganic and highly oxidized etch residues and/or for controlled etching of contaminated oxide surfaces.

ACT® XT-1100

ACT XT-1100 is a fluoride-containing chemistry formulated for removal of organic and highly oxidized etch residues on a wide range of surfaces including through-silicon vias and sidewalls.

ACT XT-1100 is a fluoride-containing chemistry formulated for removal of organic and highly oxidized etch residues on a wide range of surfaces including through-silicon vias and sidewalls.

X

This site uses cookies to store information on your computer. Some are essential to make our site work; others help us to better understand our users. By using the site, you consent to the placement of these cookies. Read our Legal Notice to learn more.

Close