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Porous Film Thin Film Deposition

Air Products supplies specialty chemicals for use in porous thin film deposition applications. Our offering includes ATRP (a Schumacher® product), Diethylmethylsiloxane (DEMS® ILD Precursor) and Porous Diethylmethylsiloxane (PDEMS® ILD Precursor).

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ATRP

ATRP, a Schumacher® product, is used as a porogen source for the PECVD Thin Film Deposition of ultra low dielectric constant films.

ATRP, a Schumacher® product, is used as a porogen source for the PECVD Thin Film Deposition of ultra low dielectric constant films.

Diethoxymethylsilane(DEMS® ILD Precursor)

Diethoxymethylsilane (DEMS® ILD Precursor), a Schumacher® product, is used as a silicon source for the chemical vapor Thin Film Deposition of high quality low dielectric constant films.

Diethoxymethylsilane (DEMS® ILD Precursor), a Schumacher® product, is used as a silicon source for the chemical vapor Thin Film Deposition of high quality low dielectric constant films.

PDEMS® ILD Process

PDEMS® (Porous Diethoxymethylsilane) is a porous organosilicate glass used for ultra-low dielectric constant films.

PDEMS® (Porous Diethoxymethylsilane) is a porous organosilicate glass used for ultra-low dielectric constant films.

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