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Residue Removal

What are BPS Products?

BPS (Better Process Solutions) is Air Products’ line of aqueous and solvent-based chemistries specifically formulated for electronics (wafer and PCB) assembly and packaging applications. These BPS products help remove or reduce metal oxidation, Fluorine contamination, organic residues including photoresist, and dicing residues.

Key Features of BPS Products:

  • Extremely low etch-rates on commonly used metals, dielectrics, epoxies, etc.
  • Compatible with widely used substrates and materials within Wafer-level chip-scale packages (WLCSP), Chip-scale packages (CSP), flip chips, leaded and non-leaded packages, BGA, ceramics and PCBs
  • Easy to use with quick processing times ranging from 5-20 minutes, followed by a short DIW rinse
  • Can be implemented on equipment commonly used in assembly/packaging facilities such as immersion wet benches, spray tools, batch tools, single wafer tools or inline tools
  • Compatible with commonly used materials of construction on equipment

What Applications can BPS products be used for?

BPS products can improve a wide variety of assembly processes such as:

Wafer/Substrate Dicing (Saw):

  • Low-resistivity dicing solution helps to efficiently remove swarf, prevent galvanic corrosion, reduce oxide build up and remove other residues during dicing; it eliminates the need for CO2 bubbling.  For dicing of silicon, ceramics and other materials

Wire Bonding:

  • Removes oxides and retards subsequent re-growth to improve surface quality of Al bond pads and improve your wire bod processes (Au or Cu wire); an effecitve replacement of Ar-plasma, improve inter-metallic compound coverage and reduce NSOPs
  • Improve the surface quality of leadframes and substrates, reducing oxidation and organic contamination; reduce NSOLs
  • Improve surface quality of Cu metalized bond pads where high temperatures used in epoxy cure and bonding can cause rapid oxidation, worsening bond quality
  • Reduce or eliminate PDMS and other organic contamination levels

Flip Chip:

  • Reduce oxidation and contamination levels on solder bumps, Cu pillars, Au stud bumps to improve adhesion
  • Allow flux-less reflow of solder bumps

Dry-film/resist strip:

  • Remove thick-film photoresist films and residues in bump/plating processes.  Both spin-on and dry-film positive or negative-acting positive resists can be removed; oven-cured polyimide may be removed

Pre-Plating Surface Preparation:

  • Excellent surface cleaning and preparation chemistries for Al and Cu, used prior to ENIG/ENIPIG/electrolytic processes; eliminate hazardous acids and simplify processes while improving cost and performance with BPS

Packaged Your Way

BPS solutions save you more because they have a two-year shelf life, can be applied at room temperature and do not contain PFOS or silicones.  We package them the way you need them - gallon bottles, five-gallon pails, 55-gallon drums or 200-gallon totes. 

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Product NameDescription/BenefitsDownloads

BPS-100 Aluminum oxide and organics remover (solvent-based)

BPS-100 was developed to remove Al oxide, Fluorine and organic contamination, and is an excellent Ar plasma alternative.  BPS-100 is used for wafer, leadframe, substrate and board cleaning, as well as pre-plating surface preparation.

BPS-100 was developed to remove Al oxide, Fluorine and organic contamination, and is an excellent Ar plasma alternative.  BPS-100 is used for wafer, leadframe, substrate and board cleaning, as well as pre-plating surface preparation.

BPS-106-Oxidation-and-Organics-Removal

BPS-106 is a formulated semi-aqueous product optimized for cleaning of Aluminum surfaces to enhance wirebond-related process and device reliability. 

 

BPS-106 is a formulated semi-aqueous product optimized for cleaning of Aluminum surfaces to enhance wirebond-related process and device reliability. 

 

BPS-169 Positive Photoresist Stripper

BPS-169 is effective in removing photoresist films in bumping and plating processes.

BPS-169 is effective in removing photoresist films in bumping and plating processes.

BPS-170 Aqueous Copper oxide remover

BPS-170 was developed for the removal and re-growth retardation of copper oxide wafer, leadframe/substrate and board cleaning; pre-plating surface preparation; and solder bump/copper pillar cleaning.

BPS-170 was developed for the removal and re-growth retardation of copper oxide wafer, leadframe/substrate and board cleaning; pre-plating surface preparation; and solder bump/copper pillar cleaning.

BPS-600 Oxidation and Organics Removal

Optimized for Aluminum and Copper Metals, BPS-600 is a formulated semi-aqueous for cleaning of Aluminum and Copper bond pad wafers to enhance wirebond-related process/device reliability.

 

Optimized for Aluminum and Copper Metals, BPS-600 is a formulated semi-aqueous for cleaning of Aluminum and Copper bond pad wafers to enhance wirebond-related process/device reliability.

 

BPS-729A Surfactant-formulated low resistivity dicing solution (aqueous)

BPS-729A is effective in dicing residues (swarf), cooling and lubrication, ESD reduction, galvanic corrosion prevention and oxidation reduction.  BPS-729A is used in wafer and substrate dicing (saw).

BPS-729A is effective in dicing residues (swarf), cooling and lubrication, ESD reduction, galvanic corrosion prevention and oxidation reduction.  BPS-729A is used in wafer and substrate dicing (saw).

BPS-729-B Surfactant-formulated dicing solution

BPS-729-B is a surfactant-formulated solution that is used as an additive to DIW during the dicing process for high-performance cleaning through superior wetting.

BPS-729-B is a surfactant-formulated solution that is used as an additive to DIW during the dicing process for high-performance cleaning through superior wetting.

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