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Microelectromechanical Systems (MEMS)

For manufacturers in the Microelectromechanical Systems (MEMS) market, Air Products is now offering a stable, low-cost supply of XeF2. With more than a 35 year history of fluorine expertise, we are ready to be your XeF2 supplier.

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Ammonia (NH3)

Ammonia (NH3) is a colorless, pungent, flammable gas at atmospheric pressure and temperature. We sell various grades of ammonia for the semiconductor industry; for the LED/Compound Semiconductor market, we sell both White Ammonia and Blue Ammonia, in addition to our standard Ammonia offering.

Ammonia (NH3) is a colorless, pungent, flammable gas at atmospheric pressure and temperature. We sell various grades of ammonia for the semiconductor industry; for the LED/Compound Semiconductor market, we sell both White Ammonia and Blue Ammonia, in addition to our standard Ammonia offering.

Arsine (AsH3)

Air Products offers two versions of Arsine gas (AsH3). Megabit™ Grade Arsine (99.9999%) is our standard high-purity grade for optoelectrical and photovoltaic applications. Megabit™ III Grade Arsine (99.99995%) is our highest-purity grade for optoelectrical and photovoltaics applications, featuring full metals analysis.

Air Products offers two versions of Arsine gas (AsH3). Megabit™ Grade Arsine (99.9999%) is our standard high-purity grade for optoelectrical and photovoltaic applications. Megabit™ III Grade Arsine (99.99995%) is our highest-purity grade for optoelectrical and photovoltaics applications, featuring full metals analysis.

Carbon Tetrafluoride (CF4)

Carbon Tetrafluoride (CF4) is used for chamber cleaning in semiconductor applications, in MEMS etching applications, and in Flat Panel Display etching applications.

Carbon Tetrafluoride (CF4) is used for chamber cleaning in semiconductor applications, in MEMS etching applications, and in Flat Panel Display etching applications.

Difluoromethane (CH2F2)

Difluoromethane (CH2F2) is an anisotropic etching gas for forming high aspect ratio features in silicon and silicon oxide.  Also known as Halocarbon 32, it is used in semiconductor, MEMS, and flat panel display applications.

Difluoromethane (CH2F2) is an anisotropic etching gas for forming high aspect ratio features in silicon and silicon oxide.  Also known as Halocarbon 32, it is used in semiconductor, MEMS, and flat panel display applications.

Germane (GeH4)

Germane (GeH4) is a gas used for depositing the SiGe layer, which provides improved electric properties.

Germane (GeH4) is a gas used for depositing the SiGe layer, which provides improved electric properties.

Germane (GeH4) in Hydrogen (H2) Mixture

10% ±0.2% Germane (GeH4) in Hydrogen (H2) Mixture used in semiconductor thin film deposition applications.

10% ±0.2% Germane (GeH4) in Hydrogen (H2) Mixture used in semiconductor thin film deposition applications.

Hexafluorobutadiene C4F6)

C4F6 (Hexafluoro-1,3-butadiene) is used for dielectric etch applications. Hexafluoro-1,3-butadiene is a toxic, colorless, odorless, flammable liquefied compressed gas.

C4F6 (Hexafluoro-1,3-butadiene) is used for dielectric etch applications. Hexafluoro-1,3-butadiene is a toxic, colorless, odorless, flammable liquefied compressed gas.

Hexafluoroethane (C2F6)

Megaclass Grade Hexafluoroethane (C2F6), also known as Halocarbon 116, is our highest purity offering for semiconductor and MEMS etching applications and MEMS chamber cleaning applications.  Halocarbon 116 is a colorless, odorless, liquefied gas.

Megaclass Grade Hexafluoroethane (C2F6), also known as Halocarbon 116, is our highest purity offering for semiconductor and MEMS etching applications and MEMS chamber cleaning applications.  Halocarbon 116 is a colorless, odorless, liquefied gas.

Hydrogen Chloride (HCl)

Hydrogen Chloride (HCl) is used in various surface cleaning processes and to clean LPCVD chambers.

Hydrogen Chloride (HCl) is used in various surface cleaning processes and to clean LPCVD chambers.

Nitrogen Trifluoride (NF3)

Nitrogen Trifluoride (NF3) is used in Displays/Flat Panel, Photovoltaics, Compound Semiconductor, MEMS and Silicon Semiconductor manufacturing processes.

Nitrogen Trifluoride (NF3) is used in Displays/Flat Panel, Photovoltaics, Compound Semiconductor, MEMS and Silicon Semiconductor manufacturing processes.

Nitrous Oxide (N2O)

Nitrous Oxide (N2O) is an oxidant for depositing various types of oxide films.

Nitrous Oxide (N2O) is an oxidant for depositing various types of oxide films.

Octafluorocyclobutane (C4F8)

Octafluorocyclobutane (C4F8) is an anisotropic etching gas used for etching high aspect ratio features in silicon and silicon oxide. The material is used to produce polymer films in Bosch type deep silicon etching processes.

Octafluorocyclobutane (C4F8) is an anisotropic etching gas used for etching high aspect ratio features in silicon and silicon oxide. The material is used to produce polymer films in Bosch type deep silicon etching processes.

Octafluorocyclopentene (C5F8)

C5F8 (Octafluorocyclopentene) VLSI grade (99.99%) is our highest purity grade for semiconductor, MEMS, and flat panel display applications.  Octofluorocylopentene is a toxic, non-flammable, low boiling point (81oF) coloress liquid with a slight distinctive odor.

C5F8 (Octafluorocyclopentene) VLSI grade (99.99%) is our highest purity grade for semiconductor, MEMS, and flat panel display applications.  Octofluorocylopentene is a toxic, non-flammable, low boiling point (81oF) coloress liquid with a slight distinctive odor.

Silicon Tetrafluoride (SiF4)

Silicon Tetrafluoride (SiF4) is a source of fluorine for processes requiring controlled concentrations of fluorine present to form low-k films.

Silicon Tetrafluoride (SiF4) is a source of fluorine for processes requiring controlled concentrations of fluorine present to form low-k films.

Tetraethyl Orthosilicate (TEOS)

Tetraethyl Orthosilicate (TEOS) is used as a semiconductor silicon source for the Thin Film Deposition of doped and undoped silicon dioxide films.  It is used as a replacement for silane and other pyrophoric silicon sources.

Tetraethyl Orthosilicate (TEOS) is used as a semiconductor silicon source for the Thin Film Deposition of doped and undoped silicon dioxide films.  It is used as a replacement for silane and other pyrophoric silicon sources.

Trifluoromethane (CHF3)

Trifluoromethane (CHF3) is an Anisotropic etching gas for forming high aspect ratio features in silicon and silicon oxide.

Trifluoromethane (CHF3) is an Anisotropic etching gas for forming high aspect ratio features in silicon and silicon oxide.

Xenon (Xe)

Xenon (Xe) is an additive for etching processes to enhance polymer formation and etching rates.

Xenon (Xe) is an additive for etching processes to enhance polymer formation and etching rates.

Xenon Difluoride (XeF2)

Xenon Difluoride (XeF2) is a highly selective isotropic etching gas used in flat panel displays (TFT/LCD) and MEMS etching applications.

Xenon Difluoride (XeF2) is a highly selective isotropic etching gas used in flat panel displays (TFT/LCD) and MEMS etching applications.

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