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Amicure®

Product NameDescription/BenefitsDownloads

Amicure 101

Low-viscosity, nonstaining, MDA-free aromatic amine. Lower exotherm and higher heat resistance than MDA. Used in filament-wound pipe, electrical encapsulation, tooling, large castings, and adhesives.

Low-viscosity, nonstaining, MDA-free aromatic amine. Lower exotherm and higher heat resistance than MDA. Used in filament-wound pipe, electrical encapsulation, tooling, large castings, and adhesives.

Amicure CG1200G

Dicyandiamide pulverized to 90% less than 30 micron particle size. Contains 1.5% of an inert flow control additive. Used in powder coatings; structural laminates, including solvent-free prepregs; one-component adhesives; and film adhesives.

Dicyandiamide pulverized to 90% less than 30 micron particle size. Contains 1.5% of an inert flow control additive. Used in powder coatings; structural laminates, including solvent-free prepregs; one-component adhesives; and film adhesives.

Amicure CG325G

Dicyandiamide pulverized to 90% less than 44 micron particle size. Contains 1.5% of an inert flow control additive. Used in structural laminates and one-component adhesives.

Dicyandiamide pulverized to 90% less than 44 micron particle size. Contains 1.5% of an inert flow control additive. Used in structural laminates and one-component adhesives.

Amicure CGNA

Unpulverized dicyandiamide with no inert flow control agent. Used in electrical laminates, adhesives, and powder coatings, where the total resin system is pulverized prior to extrusion.

Unpulverized dicyandiamide with no inert flow control agent. Used in electrical laminates, adhesives, and powder coatings, where the total resin system is pulverized prior to extrusion.

Amicure DBUE

Unpulverized dicyandiamide with no inert flow control agent. Used in electrical laminates, adhesives, and powder coatings, where the total resin system is pulverized prior to extrusion.

Unpulverized dicyandiamide with no inert flow control agent. Used in electrical laminates, adhesives, and powder coatings, where the total resin system is pulverized prior to extrusion.

Amicure PACM

Low-color, low-viscosity unmodified cycloaliphatic amine. Improved fracture toughness. Used in filament winding, wet lay-up laminating, casting, RIM, and pultrusion.

Low-color, low-viscosity unmodified cycloaliphatic amine. Improved fracture toughness. Used in filament winding, wet lay-up laminating, casting, RIM, and pultrusion.

Amicure UR

Substitute for chlorophenyl ureas; co-curing accelerator for dicyandiamide-cured epoxy resins. Exceptional latency and rapid cure above activation temperature. Used in one-component paste and film adhesives, high-performance composites, and prepregs.

Substitute for chlorophenyl ureas; co-curing accelerator for dicyandiamide-cured epoxy resins. Exceptional latency and rapid cure above activation temperature. Used in one-component paste and film adhesives, high-performance composites, and prepregs.

Amicure UR 7/10

Substituted urea-based accelerator for dicyandiamide-cured epoxy resins. Finely ground version of AMICURE® UR7/10. Used in one-component adhesives, heat-cured composites, and prepregs.

Substituted urea-based accelerator for dicyandiamide-cured epoxy resins. Finely ground version of AMICURE® UR7/10. Used in one-component adhesives, heat-cured composites, and prepregs.

Amicure UR2T

Substitute for chlorophenyl ureas; co-curing accelerator for dicyandiamide-cured epoxy resins. Faster green strength adhesion build. Used in one-component paste and film adhesives, high-performance composites, and prepregs.

Substitute for chlorophenyl ureas; co-curing accelerator for dicyandiamide-cured epoxy resins. Faster green strength adhesion build. Used in one-component paste and film adhesives, high-performance composites, and prepregs.

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